Deal Announcements

Wireless Glue Garners Venture Capital Funding

Monday, February 25, 2013 5:57:00 AM PDT | VentureDeal

   Lafayette, California  --  Software technology company Wireless Glue Networks has received $4.5 million in its second round of venture capital investment.

Wireless Glue has developed software that brings the Smart Edge Energy Management Solution to the STiNC II gateway platform.

Investors in the round included The Innovation Network Corporation of Japan, Clean Pacific Ventures, Toko Electric and Hosiden Corporation.

The company did not say how the funding proceeds would be used.

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