CA -- Semiconductor company
Kovio, Inc. announced the first closing of its series D round of financing,
receiving $19.5 million from a syndicate of venture capital firms.
Kovio is developing a new category of printed silicon
electronics and thin film technologies.
The company is targeting applications in the retail, pharmaceutical,
consumer electronics, transportation, manufacturing and energy industries.
Investors in the round were lead investor Pinnacle Ventures,
Bessemer Venture Partners, DAG Ventures, Flagship Ventures, Harris & Harris
Group, Jerusalem Venture Partners, Kleiner Perkins Caufield & Byers and
others. Proceeds from the financing will
be used for additional product development.