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Kovio Clears Fourth Round Of Venture Funding

Wednesday, September 05, 2007 5:00:00 AM PDT | VentureDeal Staff

SUNNYVALE, CA -- Semiconductor company Kovio, Inc. announced the first closing of its series D round of financing, receiving $19.5 million from a syndicate of venture capital firms.

Kovio is developing a new category of printed silicon electronics and thin film technologies.  The company is targeting applications in the retail, pharmaceutical, consumer electronics, transportation, manufacturing and energy industries.

Investors in the round were lead investor Pinnacle Ventures, Bessemer Venture Partners, DAG Ventures, Flagship Ventures, Harris & Harris Group, Jerusalem Venture Partners, Kleiner Perkins Caufield & Byers and others.  Proceeds from the financing will be used for additional product development.

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