Deal Announcements

Inside Contactless Secures Third Venture Capital Round

Tuesday, July 01, 2008 5:39:00 AM PDT | VentureDeal Staff

Aix-en-Provence, France --  Semiconductor company Inside Contactless has secured a new investment from a strategic partner.

The company is a fabless semiconductor manufacturer that delivers contactless semiconductor applications for bank card payments and near field communications.

Samsung Ventures made the investment, which was an extension of the series C round.  The company said the funding would allow it to accelerate its international footprint and broaden its product portfolio.

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