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Bump Technologies Lands $16 Million New VC

Wednesday, January 12, 2011 5:33:00 AM PDT | VentureDeal Staff
   Mountain View, California  --  Mobile technology company Bump Technologies has announced that it has received $16 million in its second round of institutional venture capital investment.

Bump has created the ability for two cell phone users to connect their phones by simply bumping them together.

Andreessen Horowitz was the lead investor in the round, which also included Sequoia Capital, Sherpalo Ventures, SV Angel and others.

The company said it would use the funding to build out its engineering and product organization.

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