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Inpria Adds Venture Capital Equity Financing

Thursday, June 12, 2014 5:45:00 AM PDT | VentureDeal

   Corvallis, Oregon  --  Advanced materials company Inpria has secured $725,000 in additional venture capital funding, according to an SEC regulatory filing.

Inpria is developing technologies that extend semiconductor lithography with inorganic photoresists for nanoscale patterning.

Investors in the financing were not disclosed, nor was how the company intends to use the funding proceeds.

Inpria is still seeking $3.4 million in additional financing, according to the filing.

The company is backed by strategic investors such as Applied Ventures, Intel Capital and Samsung Ventures.

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