Skokie, Illinois -- Advanced materials technology company Polyera has landed $13.66 million in new venture capital debt funding, according to an SEC regulatory filing.
Polyera provides dielectric, interfacial and semiconductor materials for the printed and flexible electronics industry.
Investors in the financing were not disclosed, nor was how the company intends to use the funding proceeds.
A total of nine investors participated in the offering.
Polyera is still seeking $4 million in additional debt financing, according to the filing.